Methods of forming charge storage structures including etching diffused regions to form recesses

ABSTRACT

Methods are disclosed that include selectively etching diffused regions to form recesses in semiconductor material, and forming charge storage structures in the recesses. Additional embodiments are disclosed.

BACKGROUND

Higher memory density is always in demand to provide smaller devices with increased memory capacity. Forming memory devices laterally on a surface of a semiconductor chip uses a great deal of chip real estate. Improved memory devices are needed with new configurations to further increase memory density beyond what is available with traditional devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1D show process operations of forming a semiconductor device according to an embodiment of the invention.

FIG. 2A shows a memory device according to an embodiment of the invention.

FIG. 2B shows a block diagram of a portion of the memory device from FIG. 1A according to an embodiment of the invention.

FIG. 3 shows a graph of etch rate versus boron concentration according to an embodiment of the invention.

FIG. 4 shows an information handling system using a memory device according to an embodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description of the invention, reference is made to the accompanying drawings that form a part hereof and in which are shown, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and logical, electrical, material changes, etc. may be made.

The term “horizontal” as used in this application is defined as a plane parallel to the conventional plane or surface of a substrate, such as a wafer or die, regardless of the orientation of the substrate. The term “vertical” refers to a direction perpendicular to the horizontal as defined above. Prepositions, such as “on”, “side” (as in “sidewall”), “higher”, “lower”, “over” and “under” are defined with respect to the conventional plane or surface being on the top surface of the substrate, regardless of the orientation of the substrate. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.

FIG. 1A shows a substrate 100 including alternating materials. At least one dielectric material 102 is shown with at least one semiconductor material 104. In one example, the dielectric material 102 includes silicon oxide. In one example, the semiconductor material 104 includes silicon, such as doped polysilicon. In one example, the polysilicon silicon is doped p-type. Acceptable p-type dopants include, but are not limited to boron, aluminum, gallium and indium. In one example, the semiconductor material 104 is heavily doped (p+). In one example, the semiconductor material is doped to a concentration greater than approximately 8×10¹⁹ atoms/cm³.

An opening 110 having a sidewall 112 is shown in the substrate 100. FIG. 1A shows a substantially vertical opening 110 for illustration, however in other examples, the opening 110 may be in a different orientation, such as horizontal. In the example shown, the substrate 100 includes multiple layers of alternating dielectric material 102 and semiconductor material 104. In at least some embodiments, the dielectric material of the various dielectric material layers is the same dielectric material, and/or the semiconductor material of the various semiconductor material layers is the same semiconductor material, although different layers of dielectric material may comprise different dielectric materials and/or different layers of semiconductor material may comprises different semiconductor materials. The example stacked configuration may be useful to form specific devices, such as memory string devices, although the invention is not so limited. Other semiconductor structures will benefit from applying the methods described below.

FIG. 1B shows further processing of the substrate 100. A diffused region 106 is shown formed into a semiconductor material 104, with an interface 108 between the diffused region 106 and the semiconductor material 104. In FIG. 1B, multiple diffused regions 106 are shown to form part of the multi-layer stack substrate. In one example, the diffused region 106 is diffused with n-type dopants. Acceptable n-type dopants include, but are not limited to phosphorous, arsenic, and antimony.

The diffusion mechanism of the n-type dopant into the semiconductor material 104 provides a number of useful features with respect to the diffused regions 106 and the opening 110. Diffusion distance into the semiconductor portion 104 is substantially dependent on time, temperature, and concentration of a dopant source. Diffusion distance into the semiconductor material 104 is not substantially affected by aspect ratio or depth of the opening 110. As a result, the diffused regions 106 extend a substantially identical distance into the semiconductor material 104 at the top 116 and the bottom 118 of the opening 110. Although diffusion of an n-type dopant is used as an example, other dopants, such as p-type dopants, that provide etching selectivity are also within the scope of the invention.

In one example, phosphorous is used as the n-type dopant. One example of phosphorous diffusion includes furnace processing using phosphine as a phosphorous source. Another example of phosphorous diffusion includes furnace processing using POCl₃ gas as a phosphorous source. Another example of phosphorous diffusion includes deposition of a phosphorous doped material on an exposed surface of the semiconductor material 104, and a subsequent anneal to drive the phosphorous into the semiconductor material 104. Example materials to provide dopants to diffuse into the exposed surface of the semiconductor material 104 include phosphorous doped polysilicon, or phospho-silicate glass. Examples of deposition include chemical vapor deposition and pulsed laser ablation deposition.

FIG. 1C shows further processing of the substrate 100. In FIG. 1C, the diffused regions 106 are removed through an etching process, leaving recesses 120. Because the diffused regions 106 are n-type, and the semiconductor material 104 is p-type, the interface 108 serves as an etch stop. A number of etchant processes are available that are selective between n-type and p-type silicon. For example, a number of etchant processes are available that are highly selective between n-type and heavily doped p-type silicon. One example includes wet etch processes. In one example, hydroxyl chemistry wet etch processes are used. One example of wet etch chemistry includes NH₄OH etchants. Another example of wet etch chemistry includes tetramethylammonium hydroxide (TMAH) etchants. Another example of wet etch chemistry includes potassium hydroxide (KOH) etchants. In embodiments where dopants other than n-type are used to form the interface 108, an appropriate etchant is chosen with selectivity to the chosen dopant.

Attempting to etch a same doped semiconductor material 104 by itself presents a number of technical challenges. P+ doped silicon, for example, is difficult to etch at an appreciable rate using wet etch chemistries based on hydroxides. HF—HNO₃ based chemistries can etch p+ doped silicon, however HF—HNO₃ based chemistries are not sufficiently selective with respect to dielectrics such as silicon oxide. Plasma etch is sensitive to aspect ratio, such that a layer of material at the bottom 118 of the opening 110 may etch more slowly than a layer of material at the top 116 of the opening 110.

In the processes of an embodiment of the present invention, diffusion of n-type dopants into the semiconductor material 104 is substantially insensitive to aspect ratio or depth within the opening 110. Subsequent etchant chemistries, such as the example hydroxyl chemistries listed above, are available that are selective between n-type and p-type silicon, and selective with respect to dielectrics such as silicon oxide. As a result, the recesses 120 formed are substantially consistent in their distance into the semiconductor material 104 from a sidewall 112 of the opening 110 from the top 116 to the bottom 118 of the opening 110.

FIG. 1D shows further processing of the substrate 100. A first cell dielectric (e.g., a gate oxide) 122 is formed within the recesses 120. A charge storage structure, such as a floating gate 124 or trap material, is then formed over the first cell oxide 122 in the recesses 120. A second gate oxide 126 is then formed over the floating gate 124. Consistently sized recesses 120 yield consistently sized charge storage structures (e.g., floating gates), and consistently sized charge storage structures provide consistent operating characteristics in memory devices. In subsequent process operations, an elongated channel region (not shown) may be formed within the opening 110 to form a memory string, such a NAND memory string.

FIG. 1D shows the formation of floating gates 124 in the recesses 120. In other examples, different charge storage structures may be formed within the recesses 120. Another example of possible charge storage structures may include nitride trap layers (e.g., as part of an oxide-nitride-oxide structure).

As discussed above, memory devices are one type of semiconductor device that may be formed using the etching processes described. FIG. 2A shows an example memory device formed using the processes shown in FIGS. 1A-1D. FIG. 2A shows a dielectric 212 that substantially surrounds an elongated channel region 210. A plurality of memory cell gates 214 are shown along the elongated channel region 210, defining a plurality of memory cells. In one example, the memory cell gates 214 include floating gates, such as floating gates 124 from FIG. 1D. A first select gate 220 and a second select gate 222 are shown to selectively electrically couple the elongated channel region 210 to drain region 232 and a source region 230, respectively. A dielectric 204 can fill in spaces between two or more of the components described above.

FIG. 2A shows an embodiment of a memory device 200 where the elongated channel region 210 forms a “U” shape with a pair of upward facing ends 211, 213. In one example, a “U” shaped channel region is formed in a pair of openings, such as opening 110 from FIGS. 1A-1D, that are connected at their respective bottoms 118. Another example configuration includes a linear, vertical, elongated channel region 210 with one end facing upward, and the other end facing downward. Embodiments with two upward facing ends, 211, 213, such as the substantially “U” shaped configuration, enable easier formation of some components at the ends 211, 213 of the elongated channel region 210 during manufacture, compared to embodiments where components are formed deeper in the structure.

In one example, the elongated channel region 210 comprises n type semiconductor material, such as n-type polysilicon. A source region 230 and a drain region 232 are shown coupled to a first end 211 and a second end 213 of the elongated channel region 210, respectively. In one example, the source region 230 and the drain region comprises p type semiconductor material, such as p-polysilicon. In operation, the pathway of source region 230, to elongated channel region 210, to drain region 232 acts as a p-n-p transistor, with select gates 220, 222, and memory cell gates 214 operating to allow, or inhibit signal transmission along the way. In the example shown, the source region 230, elongated channel region 210, drain region 232, select gates 220, 222, and memory cell gates 214 collectively form a memory cell string 201. In the example shown in FIG. 2A, each memory cell string 201 has a separate drain select gate 220, while a source select gate 222 is shared between adjacent memory cell strings 201.

A source line 226 and a data line, such as bitline 228, are shown coupled to the source region 230 and the drain region 232 respectively. In one embodiment, a plug 224 is used to couple the bitline 228 to the drain region 232. Each of the source line 226, bitline 228 and plug 224 can comprise, consist of, or consist essentially of metal, such as aluminum, copper, or tungsten, or alloys of these or other conductor metals. As used herein, the term “metal” further includes metal nitrides, or other materials that operate primarily as conductors.

FIG. 2B shows a block diagram of memory cell string 201 from FIG. 2A. The elongated channel region 210 is shown, with a number of floating gates 214 and a number of control gates 216. The select gates 220, 222 are shown adjacent to the first end 211 and the second end 213 of the elongated channel region 210.

FIG. 3 shows a graph 300 of etch rate versus boron concentration for an example wet etchant according to an embodiment of the invention. Potassium hydroxide as an etchant is illustrated in FIG. 3, however similar etch rate characteristics as a function of dopant concentrations are found with respect to other hydroxyl etchant chemistries.

FIG. 3 shows a marked change in etch rate at boron concentrations beginning at point 302 on the graph. At concentrations greater than about 8×10¹⁹ atoms/cm³ shown at line 310 the etch rate for potassium hydroxide has dropped off significantly from the steady rate to the left of point 302. As illustrated by the graph 300, with boron concentrations greater than about 8×10¹⁹ atoms/cm³ indicated by arrow 312, potassium hydroxide does not significantly etch. This property provides selectivity between n-type and p-type materials, as described in relation to FIGS. 1A-1D above. This selectivity allows the interface between p-type and n-type materials to serve as an etch stop, where etching substantially stops. While some level of etching may continue to occur at an etch stop, because of the order of magnitude differences in etch rate (such as the example in FIG. 3), the etching is considered to have substantially stopped. In one example, the etch stop interface includes etch selectivity greater than approximately 20 to 1. The etch stop provides a process to form consistently-sized structures, such as floating gates, within high aspect ratio openings in devices such as vertical NAND memory devices.

In one specific example using TMAH, testing provided the following etch rate results.

Etch rate (μm/min) Solution temp (° C.) 1e21 B 3e18 B 1e15 B 3e14 P TMAH 10:1 66 0.599 0.62 78 0.833 0.598 0.84 65 ~0.0020

The table confirms that heavily doped boron (for example 1×10²¹ atoms/cm³ in the table) has a dramatic fall in etch rate.

An embodiment of an information handling system such as a computer is included in FIG. 4 to show an embodiment of a high-level device application for some embodiments of the present invention. FIG. 4 is a block diagram of an information handling system 400 incorporating a memory device 407 formed according to embodiments of the invention as described above. Information handling system 400 is merely one embodiment of an electronic system in which decoupling systems of the present invention can be used. Other examples of such systems include, but are not limited to, tablet computers, cameras, personal data assistants (PDAs), cellular telephones, MP3 players, aircraft, satellites, military vehicles, etc.

In this example, information handling system 400 comprises a data processing system that includes a system bus 402 to couple the various components of the system. System bus 402 provides communications links among the various components of the information handling system 400 and may be implemented as a single bus, as a combination of busses, or in any other suitable manner.

Chip assembly 404 is coupled to the system bus 402. Chip assembly 404 may include any circuit or operably compatible combination of circuits. In one embodiment, chip assembly 404 includes a processor 406 that can be of any type. As used herein, “processor” means any type of computational circuit such as, but not limited to, a microprocessor, a microcontroller, a graphics processor, a digital signal processor (DSP), or any other type of processor or processing circuit.

In one embodiment, a memory device 407 is included in the chip assembly 404. In one embodiment, the memory device 407 includes a NAND memory device formed according to embodiments described above. In one embodiment, the processor 406 and memory device 407 are formed on the same chip.

In one embodiment, additional logic chips 408 other than processor chips are included in the chip assembly 404. An example of a logic chip 408 other than a processor includes an analog to digital converter. Other circuits on logic chips 408 such as custom circuits, an application-specific integrated circuit (ASIC), etc. are also included in one embodiment of the invention.

Information handling system 400 may also include an external memory 411, which in turn can include one or more memory elements suitable to the particular application, such as one or more hard drives 412, and/or one or more drives that handle removable media 413 such as compact disks (CDs), flash drives, digital video disks (DVDs), and the like. A semiconductor memory die constructed as described in examples above is included in the information handling system 400.

Information handling system 400 may also include a display device 409 such as a monitor, additional peripheral components 410, such as speakers, etc. and a keyboard and/or controller 414, which can include a mouse, touch sensor, voice-recognition device, or any other user interface device that permits a system user to input information into and receive information from the information handling system 400.

While a number of embodiments of the invention are described, the above lists are not intended to be exhaustive. Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement that is calculated to achieve the same purpose may be substituted for the specific embodiment shown. This application is intended to cover any adaptations or variations of the present invention. It is to be understood that the above description is intended to be illustrative and not restrictive. Combinations of the above embodiments, and other embodiments, will be apparent to those of skill in the art upon studying the above description. 

1. A method, comprising: forming a diffused region into a semiconductor material exposed to an opening in a substrate; selectively etching the diffused region to form a recess in the semiconductor material, wherein etching substantially stops at an interface between the diffused region and the semiconductor material; and forming a charge storage structure in the recess.
 2. The method of claim 1, wherein forming a diffused region into a semiconductor material comprises diffusing a dopant into the semiconductor material exposed to the opening to form the diffused region extending into the semiconductor material a distance from a sidewall of the opening.
 3. A method, comprising: diffusing an n-type dopant into a p-type semiconductor material exposed to an opening in a substrate to form an n-type region extending a distance into the p-type semiconductor material from a sidewall of the opening; and selectively etching the n-type region to form a recess in the p-type semiconductor material, wherein etching substantially stops at an interface between the n-type region and the p-type semiconductor material.
 4. The method of claim 3, wherein diffusing the dopant into the exposed p-type semiconductor material includes diffusing the dopant into an exposed p+ semiconductor material.
 5. The method of claim 3, wherein diffusing the dopant into the exposed p-type material includes diffusing the dopant into an exposed boron doped semiconductor material.
 6. The method of claim 3, wherein concentration of dopant atoms in the p-type semiconductor material is greater than 8×10¹⁹ atoms/cm³.
 7. The method of claim 3, wherein selectively etching the n-type region includes wet etching the n-type region.
 8. The method of claim 7, wherein wet etching the n-type region includes selectively etching using hydroxyl etchant chemistry.
 9. The method of claim 8, wherein wet etching the n-type region includes selectively etching using NH₄OH.
 10. The method of claim 8, wherein wet etching the n-type region includes selectively etching using tetramethylammonium hydroxide.
 11. The method of claim 8, wherein wet etching the n-type region includes selectively etching using potassium hydroxide.
 12. The method of claim 3, wherein the opening comprises a vertical opening.
 13. The method of claim 3, wherein diffusing the dopant includes diffusing phosphorous.
 14. A method comprising: forming a stack of alternating layers of semiconductor material and dielectric material; forming an opening within the stack; diffusing a dopant into the semiconductor material exposed to the opening to form a plurality of diffused regions, each of the diffused regions extending a distance into the semiconductor material from a sidewall of the opening; selectively etching the diffused regions to form recesses in the semiconductor material, wherein etching substantially stops at each interface between the semiconductor material and the diffused regions; forming a first cell dielectric material within the recesses; forming charge storage structures over the first cell dielectric material within the recesses; and forming a channel region within the opening, separated from the charge storage structures by a second cell dielectric material.
 15. The method of claim 14, further including forming a source line coupled to a first end of the channel region, and a data line coupled to a second end of the channel region.
 16. The method of claim 14, wherein forming a channel region within the opening comprises forming a U-shaped channel region within a pair of openings.
 17. The method of claim 14, wherein diffusing the dopant includes furnace processing.
 18. The method of claim 14, wherein diffusing the dopant includes diffusion with phosphine.
 19. The method of claim 14, wherein diffusing the dopant includes diffusion with POCl₃ gas.
 20. The method of claim 14, wherein diffusing the dopant includes depositing a material doped with an n-type dopant on the exposed semiconductor material and annealing to drive the n-type dopant into the exposed semiconductor material.
 21. The method of claim 14, wherein diffusing the dopant includes pulsed laser ablation depositing a material doped with an n-type dopant on the exposed semiconductor material and annealing to drive the n-type dopant into the exposed semiconductor material.
 22. A method comprising: forming a stack of alternating p-type polysilicon and dielectric layers; forming an opening within the stack; diffusing an n-type dopant into the p-type polysilicon exposed to the opening to form a plurality of n-type regions, each of the n-type regions extending a distance into the p-type polysilicon from a sidewall of the opening; selectively etching the n-type regions to form recesses in the p-type polysilicon, wherein etching substantially stops at each interface between the n-type regions and the p-type polysilicon; and forming charge storage structures within the recesses.
 23. The method of claim 22, wherein forming the charge storage structures includes forming floating gates.
 24. The method of claim 22, wherein forming the charge storage structures includes forming the structures with a nitride charge trap layer. 